Method for adjusting rapid thermal processing (RTP) recipe setpoints based on wafer electrical test (WET) parameters
AssigneeAdvanced Micro Devices, Inc.
InventorsTerrence J. Riley, William Jarrett Campbell
Life of this patent
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Abstract
A method is provided, the method comprising measuring at least one parameter characteristic of processing performed on a workpiece in a processing step, and modeling the at least one characteristic parameter measured using a correlation model. The method also comprises applying the correlation model to modify the processing performed in the processing step.
Claims35
A method, comprising:
- measuring at least one characteristic parameter relating to a rapid thermal processing step performed on a workpiece;
- modeling the at least one characteristic parameter measured using a correlation model;
- and
- applying the correlation model to modify the processing performed in the processing step.
A computer-readable, program storage device, encoded with instructions that, when executed by a computer, perform a method comprising:
- measuring at least one characteristic parameter relating to a rapid thermal processing step performed on a workpiece;
- modeling the at least one characteristic parameter measured using correlation model;
- and
- applying the correlation model to modify the processing performed in the processing step.
A computer programmed to perform a method comprising:
- measuring at least one characteristic parameter relating to a rapid thermal processing step performed on a workpiece;
- modeling the at least one characteristic parameter measured using a correlation model;
- and
- applying the correlation model to modify the processing performed in the processing step.
An apparatus, comprising:
- a controller for controlling a processing to perform a rapid thermal process upon a first workpiece and for controlling a measurement device to perform an electrical test upon said first workpiece to measure a characteristic parameter, said controller to model said characteristic parameter measured using a correlation model and apply said correlation model to modify said rapid thermal process performed on a second workpiece.
A system, comprising:
- a processing tool to perform a rapid thermal process upon a first workpiece and a second workpiece;
- a measurement device to perform a wafer electrical test upon said first and second workpieces to measure a characteristic parameter relating to processing of said first workpiece;
- and
- a controller for controlling said processing tool and said measurement device, said controller to model said characteristic parameter measured using a correlation model and apply said correlation model to modify said rapid thermal process performed on a second workpiece.
A method, comprising:
- measuring at least one electrical characteristic parameter relating to a rapid thermal process performed on a first workpiece;
- modeling the at least one characteristic parameter measured using a correlation model;
- and
- applying the correlation model to modify said rapid thermal process performed on a second workpiece.
Dependencies are inferred from the claim text.