Encapsulation method and leadframe for leadless semiconductor packages
AssigneeSiliconix Taiwan Ltd.
InventorFrank Kuo
Life of this patent
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Abstract
An encapsulation technique for leadless semiconductor packages entails: (a) attaching a plurality of dice (411) to die pads in cavities (41-45, 51-55) of a leadframe, the cavities arranged in a matrix of columns and rows; (b) electrically connecting the dice to a plurality of conducting portions (412-414) of the leadframe; and (c) longitudinally injecting molding material into the cavities along the columns via a plurality of longitudinal gates (46-49, 56-59) of the leadframe to package the dice in the cavities, the longitudinal gates situated between the cavities along the columns.
Claims7
A leadframe for leadless semiconductor packages, the leadframe comprising:
- a plurality of cavities wherein each of said cavities is connected to an adjacent cavity in the same column by a longitudinal gate and also connected to an adjacent cavity in the same row by a transverse gate and wherein each gate is connected separately to a corresponding cavity, each cavity having (a) at least one die pad for supporting at least one die and (b) a plurality of conducting portions for electrical connection to the at least one die, the cavities arranged in a matrix of columns and rows;
- a first gate connected to a first cavity for introducing a molding compound into said first cavity;
- a second gate connecting said first cavity to a second cavity, for flowing said molding compound into said second cavity from said first cavity;
- and
- a third gate connecting said first cavity to a third cavity, for flowing said molding compound into said third cavity from said first cavity.
A leadframe for leadless semiconductor packages, the leadframe comprising:
- a plurality of cavities wherein each of said cavities is connected to an adjacent cavity in the same column by a longitudinal gate and also connected to an adjacent cavity in the same row by a transverse gate and wherein each gate is connected separately to a corresponding cavity, each cavity having (a) at least one die pad for supporting at least one die and (b) a plurality of conducting portions for electrical connection to the at least one die, the cavities arranged in a matrix of columns and rows;
- a first gate connecting a first cavity to a second cavity;
- a second gate connecting said first cavity to a third cavity;
- and
- a third gate connecting said first cavity to a fourth cavity.
Dependencies are inferred from the claim text.