Method for making contact with a doping region of a semiconductor component

A method for making and contacting a doping region of a semiconductor component, which comprises the steps of:

• providing a silicon substrate having a substrate surface;
• introducing a dopant into the silicon substrate resulting in the doping region being formed at the substrate surface in the substrate;
• depositing and patterning an insulating layer on the substrate surface, a surface region of the doping region being uncovered;
• depositing a metal-containing layer on the insulating layer and the surface region;
• processing the substrate during a first step in a process chamber at a first temperature in a first atmosphere containing H2, for a first time duration, resulting in metal silicide being produced from a part of the metal-containing layer and a part of the doping region;
• and
• subsequently processing the substrate during a second step at a second temperature in a second atmosphere containing less than 10% H2 and more than 90% N2, for a second time duration to convert a remaining part of the metal-containing layer into metal nitride.