Low-loss on-chip transmission line for integrated circuit structures and method of manufacture

Abstract

A transmission line for an integrated circuit (IC) is composed of an assemblage of connected, individual transmission line portions. According to one embodiment, the transmission line assemblage includes two or more (i.e. a plurality of) vertically disposed, electrically connected, individual transmission line portions. Each transmission line portion is electrically connected to a vertically adjacent transmission line portion. Preferably, each transmission line portion is formed in a separate layer of the IC with connections between the transmission line portions formed by vias. As such, the subject transmission tine exhibits a low capacitance and a characteristic impedance that is easily driven. In another form, the subject invention is a system, process and/or apparatus for forming a transmission line on an integrated circuit (i.e. an on-chip transmission line). The transmission line is formed of an assemblage of connected, individual transmission lines such as those described above.

Dependencies are inferred from the claim text.