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US 6,854,979 B2Granted
Laminated socket contacts
AssigneeIntel Corporation
InventorsHong Xie, Ram Viswanath, PR Patel
Life of this patent
Estimating the term…
Abstract
A laminated socket contact is described for reducing inductance in power connections to an integrated circuit package. The contact consists of a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and ground panel layer, and at least one conductive finger extending from each of the power panel and ground panel. Various embodiments of this socket contact may be used with power bar connectors, side terminal connectors or pin connectors.
Claims15
An integrated circuit package, comprising:
- an integrated circuit;
- and
- a power bar to supply power and ground signals to the integrated circuit extending from the integrated circuit package, the power bar comprising a segmented conductive power side panel and a segmented conductive ground side panel separated by a non conductive insulation bar wherein successive segments of the conductive power side panel and segments of the conductive ground panel are on alternate sides of the power bar.
A system, comprising:
- a printed circuit board;
- a socket mounted on the printed circuit board, the socket comprising a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and ground panel, a socket body encompassing the power panel, ground panel, and non-conductive layer, a plurality of conductive fingers extending from the power panel, and a plurality of conductive fingers extending from the ground panel, the conductive fingers of the ground panel extending in the same direction as the conductive fingers of the power panel to engage segments of a power bar on an integrated circuit package;
- and
- an integrated circuit package mounted in the socket, the integrated circuit package comprising an integrated circuit, and a power bar to supply power and ground signals to the integrated circuit extending from the integrated circuit package, the power bar comprising a segmented conductive power side panel and a segmented conductive ground side panel separated by a non conductive insulation bar wherein successive segments of the conductive power side panel and segments of the conductive ground panel are on alternate sides of the power bar.
1 more element
Dependencies are inferred from the claim text.