Method and apparatus for executing plural processes on a microelectronic workpiece at a single processing station

An apparatus for processing a microelectronic workpiece, the apparatus comprising:

• a workpiece support configured to hold the microelectronic workpiece;
• a processing container configured to receive the microelectronic workpiece held by the workpiece support;
• an automated drive system connected to drive at least one of the processing container and the workpiece support holding the microelectronic workpiece relative to the other so that the microelectronic workpiece is moved between an initial processing position and a secondary processing position;
• a chemical delivery system providing at least one stream of at least one processing fluid to the processing container for application to at least one surface of the microelectronic workpiece as the microelectronic workpiece proceeds between the initial processing position and secondary processing position, the at least one stream being directed toward a first portion of the at least one surface of the microelectronic workpiece when the microelectronic workpiece is in the initial processing position, the at least one stream being directed toward a second portion of the at least one surface of the microelectronic workpiece disposed radially outwardly from the first portion, when the microelectronic workpiece is in the secondary processing position;
• and
• a control system operatively coupled to the chemical delivery system and the automated drive system and programmed with instructions that direct the drive system to move the workpiece support while the chemical delivery system directs the at least one stream toward the microelectronic workpiece.

An apparatus for processing a microelectronic workpiece, the apparatus comprising:

• a workpiece support configured to hold the microelectronic workpiece;
• a processing container configured to receive the microelectronic workpiece held by the workpiece support, the processing container being configured for immersion processing of at least one surface of the microelectronic workpiece at a first processing portion of the processing container, and configured for spray processing the at least one surface of the microelectronic workpiece at a second processing portion of the processing container;
• a drive mechanism connected to drive at least one of the processing container and the workpiece support holding the microelectronic workpiece relative to the other so that the microelectronic workpiece may be moved to a plurality of workpiece processing positions, the plurality of workpiece processing positions including at least an immersion processing position proximate the first portion of the processing container and a spray processing position proximate the second portion of the processing container;
• a first chemical delivery system configured to provide at least one processing fluid to the processing container for immersion processing of the at least one surface of the microelectronic workpiece when the microelectronic workpiece is at the immersion processing position;
• a first chemical collector system configured to assist in at least partially removing spent processing fluid provided by the first chemical delivery system while the microelectronic workpiece is at the immersion processing position;
• a second chemical delivery system configured to provide at least one processing fluid to the processing container for spray processing of the at least one surface of the microelectronic workpiece when the microelectronic workpiece is at the spray processing position, the second chemical delivery system being positioned to direct a spray of processing fluid for initial contact with the microelectronic workpiece at an initial radial position;
• a second chemical collector system configured to assist in at least partially removing spent processing fluid provided by the second chemical delivery system from the processing container while the microelectronic workpiece is at the spray processing position;
• and
• a control system operatively coupled to the second chemical delivery system and the drive mechanism and programmed with instructions that direct the drive mechanism to move the workpiece support during application of the spray from the second chemical delivery system so as to vary the radial position of the initial contact between the spray and the microelectronic workpiece.

An apparatus for processing a microelectronic workpiece, comprising:

• a workpiece support configured to hold a microelectronic workpiece;
• a processing vessel configured to receive a microelectronic workpiece held by the workpiece support;
• a drive system coupled to the workpiece support to move the workpiece support along a first axis relative to the processing vessel between a first position and a second position, the drive system being configured to tilt the workpiece support relative to the vessel about a second axis generally transverse to the first axis;
• a fluid delivery system positioned to direct at least one stream of processing fluid toward the workpiece support to impinge on a microelectronic workpiece while the workpiece support holds the microelectronic workpiece;
• and
• a control system operatively coupled to the drive system to direct the drive system to move the workpiece support while the fluid delivery system directs the at least one stream of processing fluid, wherein the control system directs the drive system to drive the microelectronic workpiece between the first position and the second position as the fluid delivery system provides the at least one stream of processing fluid for contact with at least one surface of the microelectronic workpiece, the at least one stream being directed toward a first portion of the at least one surface of the microelectronic workpiece when the microelectronic workpiece is in the first position, the at least one stream being directed toward a second portion of the at least one surface of the microelectronic workpiece disposed radially outwardly from the first position, when the microelectronic workpiece is in the second position.

An apparatus for processing a microelectronic workpiece, comprising:

• a workpiece support configured to hold the microelectronic workpiece;
• a processing container configured to receive the microelectronic workpiece held by the workpiece support;
• a drive mechanism connected to drive at least one of the processing container and the workpiece support relative to the other to move the microelectronic workpiece to at least one processing position;
• a fluid delivery system positioned to direct a spray of a processing fluid to the processing container for application to the microelectronic workpiece when the microelectronic workpiece is in the at least one workpiece processing position;
• and
• a collector system positioned to receive at least a portion of the processing fluid directed by the fluid delivery system, the collector system including a first annular channel and a second annular channel positioned at least proximate to the first annular channel, the first and second annular channels being in fluid communication with each other via a common outlet.

An apparatus for processing a microelectronic workpiece, comprising:

• a workpiece support configured to hold the microelectronic workpiece;
• a processing container configured to receive the microelectronic workpiece held by the workpiece support;
• a drive mechanism connected to drive at least one of the processing container and the workpiece support relative to the other to move the microelectronic workpiece to a plurality of processing positions;
• a first fluid delivery system positioned to provide at least one processing fluid to the processing container for application to the microelectronic workpiece when the microelectronic workpiece is in a first one of the plurality of workpiece processing positions;
• a first fluid collector system positioned to receive at least a portion of the processing fluid provided by the first fluid delivery system while the microelectronic workpiece is in the first one of the plurality of workpiece processing positions;
• a second fluid delivery system positioned to direct a spray of at least one processing fluid to the processing container for application to the microelectronic workpiece when the microelectronic workpiece is in a second one of the plurality of microelectronic workpiece processing positions;
• a second fluid collector system positioned to receive at least a portion of the processing fluid directed by the second fluid delivery system while the microelectronic workpiece is in the second one of the plurality of microelectronic workpiece processing positions, the second fluid collector including a first annular channel and a second annular channel positioned at least proximate to the first annular channel, the first and second annular channels being in fluid communication with each other via a common outlet.