Full area temperature controlled electrostatic chuck and method of fabricating same
AssigneeApplied Materials, Inc.
InventorVijay D. Parkhe
Life of this patent
Estimating the term…
Abstract
A semiconductor wafer support assembly and method of fabricating the same are provided. In one embodiment, the method and resulting assembly include attaching a pedestal joining-ring to a bottom surface of a ceramic puck. Low temperature brazing a composite cooling plate structure to the bottom surface of the ceramic puck, where the pedestal joining-ring circumscribes the composite cooling plate structure. Thereafter, a pedestal is electron-beam welded to the pedestal joining-ring.
Claims69
A semiconductor wafer support assembly comprising:
- a ceramic puck having a support surface;
- a composite cooling plate structure low temperature brazed to a bottom surface of the ceramic puck;
- a pedestal joining-ring, circumscribing the composite cooling plate structure and attached to the bottom surface of the ceramic puck;
- and
- a pedestal, electron-beam welded to the pedestal joining-ring.
A full area temperature controlled semiconductor wafer support assembly comprising:
- a ceramic puck having a wafer support surface;
- a composite cooling plate structure having a diameter at least equal to the wafer support surface, said composite cooling plate structure low temperature brazed to a bottom surface of the ceramic puck;
- a pedestal joining-ring attached to a bottom surface of the composite cooling plate structure;
- and
- a pedestal, electron-beam welded to the pedestal joining-ring.
A method of assembling a full area temperature controlled wafer support assembly including a puck having a support surface, wherein a diameter of a composite cooling plate structure is at least equal to a diameter of the support surface of the puck, comprising the steps of:
- low temperature brazing the puck to the composite cooling plate structure;
- and
- electron-beam welding the composite cooling plate structure to a pedestal.
A method of assembling a full area temperature controlled wafer support assembly, said assembly including a ceramic puck having a support surface, and a molybdenum-containing or aluminum nitride composite cooling plate structure having a diameter at least equal to a diameter of the support surface of the ceramic puck, comprising the steps of:
- disposing a gas conduit ring, a pair of cooling line rings, and a pedestal joining-ring on a bottom surface of the composite cooling plate structure;
- high temperature brazing the gas conduit ring, the pair of cooling line rings, and the pedestal joining-ring to the bottom surface of the composite cooling plate structure;
- and
- low temperature brazing a bottom surface of the ceramic puck to the composite cooling plate structure.
A method of assembling a wafer support assembly including a ceramic puck and a composite cooling plate structure, comprising the steps of:
- high temperature brazing a gas conduit ring and a pedestal joining-ring on a bottom surface of the ceramic puck;
- and
- low temperature brazing a bottom surface of the ceramic puck to the composite cooling plate structure.
A method of assembling a wafer support assembly including a ceramic puck and a composite cooling plate structure, comprising the steps of:
- disposing a gas conduit ring, a pair of cooling line rings, and a pedestal joining-ring on a bottom surface of the composite cooling plate structure;
- disposing a bottom surface of the ceramic puck over the composite cooling plate structure;
- and
- low temperature brazing the gas conduit ring, the pair of cooling line rings, and the pedestal joining-ring to the bottom surface of the composite cooling plate structure, and the bottom surface of the ceramic puck to the composite cooling plate structure.
Dependencies are inferred from the claim text.