Method of manufacturing a semiconductor device and manufacturing system
AssigneeHitachi, Ltd.
InventorsMasaru Izawa, Masahito Mori, Nobuyuki Negishi, Shinichi Tachi
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AssigneeHitachi, Ltd.
InventorsMasaru Izawa, Masahito Mori, Nobuyuki Negishi, Shinichi Tachi
Estimating the term…
Automatic generation of processing conditions will be provided, based on a database and process modeling by a computer equipped in semiconductor device fabrication equipment, by using input of wafer processing history including the thickness and quality. The computer equipped in semiconductor device fabrication equipment obtains the wafer processing and inspection results from a production line management computer in order to assist input of the process history. The computer in the fabrication equipment can be connected to computers in a fabrication equipment manufacturer on a communication network to automatically provide process conditions and maintenance schedule.
A method of manufacturing a semiconductor device, comprising the steps of:
A method of manufacturing a semiconductor device, comprising the steps of:
A manufacturing system of a semiconductor device, comprising:
Dependencies are inferred from the claim text.