Apparatuses and methods for cleaning test probes
AssigneeFormFactor, Inc.
InventorGary W. Grube
Life of this patent
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Abstract
Apparatuses and methods for cleaning test probes used in a semiconductor testing machine of the type having a plurality of test probes configured to contact the surface of a semiconductor wafer to test one or more dies formed thereon. In one embodiment, the apparatus includes a roller-support arm and a cylindrical roller supported by the roller-support arm. The roller has an outer surface comprising a sticky material. Debris on the probes will adhere to the sticky material as roller is rolled across tips of the probes. The probes are thereby cleaned.
Claims10
An apparatus for cleaning test probes for use in a semiconductor testing machine of the type having the test probes configured to contact the surface of a semiconductor wafer to test one or more dies formed thereon, the apparatus comprising:
- a roller-support arm;
- and
- a cylindrical roller supported by the roller-support art, the roller having an outer surface comprising a sticky material.
- wherein debris on the probes will adhere to the sticky material as the roller is rolled across tips of the probes, and
- wherein the roller-support arm is pivotally connected to a wafer chuck of the testing machine, the wafer chuck for supporting the semiconductor wafer to be tested.
An apparatus for cleaning test for use in a semiconductor testing machine of the type having the test probes configured to contact the surface of a semiconductor wafer to test one or more dies formed thereon, the apparatus comprising:
- a roller-support arm;
- and
- a cylindrical roller supported by the roller-support art, the roller having an outer surface comprising a sticky material.
- wherein debris on the probes will adhere to the sticky material as the roller is rolled across tips of the probes, and
- wherein the probes being cleaned comprise at least one of the following:
- needles;
- vertical probes;
- cobra probes;
- L-type probes;
- plunger probes;
- spring probes;
- and
- contact bump probes formed on a membrane.
An apparatus for cleaning test probes for use in a semiconductor testing machine of the type having the test probes configured to contact the surface of a semiconductor wafer to test one or more dies formed thereon, the apparatus comprising:
- a roller core;
- and
- a sticky material disposed about an outer surface of the roller core,
- wherein debris on the probes will adhere to the sticky material when the sticky material is engaged against tips of the probes, and
- wherein the roller core is pivotally supported by an arm adapted to engage the sticky material against the tips of the probes.
The apparatus of claim, wherein the arm extends between a pair of tracks, and wherein the sticky material engages the tips of the probes as the arm moves horizontally along the tracks.
Dependencies are inferred from the claim text.