Apparatus and method for cooling an electronic device

An electronic system, comprising:

• an enclosure containing at least one electronic device, the enclosure defining an interior;
• at least one fan mounted to the enclosure, the at least one fan generating a first airflow across the interior of the enclosure;
• a heat sink in thermal communication with the at least one electronic device;
• and
• at least one angled flow control vane at an end of the heat sink to divert a second airflow exiting the end such that the second airflow blends with the first airflow, the second airflow, prior to its diversion, being substantially orthogonal to the first airflow, the end being near a wall of the enclosure.

A method for cooling an electronic device, comprising:

• placing a heat sink in thermal communication with the electronic device;
• generating a first airflow that enters the heat sink from outside the heat sink and exits the heat sink at an end of the heat sink, the end being near an airflow obstruction;
• and
• angularly diverting the first airflow at the end such that the first airflow blends with a second airflow, the first airflow being, prior to its diversion, substantially orthogonal to the second airflow.

An apparatus for cooling an electronic device, comprising:

• means, in thermal communication with the electronic device, for dissipating heat from the electronic device;
• means for generating a first airflow that enters the means for dissipating heat from the electronic device from outside the means for dissipating heat from the electronic device and exits the means for dissipating heat from the electronic device at an end thereof;
• and
• means for angularly diverting the first airflow at the end such that the first airflow blends with a second airflow that is substantially orthogonal to the first airflow prior to its diversion, the end being near an airflow obstruction.