Integrated inductive circuits
AssigneeAltera Corporation
InventorsChong Woo, Clement Szeto, Ting-Wah Wong
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Abstract
An integrated inductor may be formed over a substrate. An aperture may be formed by a backside etch through the semiconductor substrate underneath the integrated inductor. The aperture may then be filled with a dielectric material. As a result of the removal of the underlying substrate material, magnetic and capacitive coupling of the inductor to the substrate may be reduced. In addition, in some cases, the presence of the dielectric may facilitate attachment of the resulting die to a leadframe and package without degrading the inductor's performance and may provide better structural support.
Claims8
An integrated circuit comprising:
- a substrate;
- an integrated inductor formed over a first side of said substrate;
- an aperture formed in said substrate from a second side of said substrate underneath said inductor;
- a dielectric material formed in said aperture;
- and
- a plurality of scribe holes in said substrate.
An integrated circuit comprising:
- a substrate;
- an inductor formed over a first side of said substrate;
- an aperture formed in said substrate from a second side of said substrate underneath said inductor and extending completely through said substrate from said second side of said substrate to said first side of said substrate;
- a dielectric material filling said aperture;
- a dielectric material also coating the back side of said substrate;
- an intervening layer between said inductor and said substrate;
- and
- a plurality of scribe holes formed in said substrate.
Dependencies are inferred from the claim text.