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US 6,806,506 B2Granted
Semiconductor device having leads provided with interrupter for molten resin
AssigneeRohm Co., Ltd.
InventorKazuyoshi Tsuji
Life of this patent
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Abstract
A semiconductor device includes semiconductor elements, a housing for accommodating the semiconductor elements, a resin material arranged in the housing for enclosing the semiconductor elements, and leads connected to the semiconductor elements. Each lead is divided into two portions, that is, an inner portion embedded in the resin material and an outer portion protruding from the resin material. The outer portion of the lead is provided with an enlarged part having a barrier surface directed toward the resin material.
Claims4
A semiconductor device comprising:
- a semiconductor element;
- a housing that accommodates the semiconductor element, the housing having a hollow inner space and a bottom mounting surface;
- a resin material filled within the hollow inner space of the housing short of the bottom mounting surface for enclosing the semiconductor element;
- and
- a lead that is connected to the semiconductor element and includes an inner portion embedded in the filled resin material and an outer portion protruding from the filled resin material;
- wherein said outer portion is provided with an enlarged part positioned outside the filled resin material and including a barrier surface directed toward the filled resin material, the enlarged part being located between the bottom mounting surface of the housing and the filled resin material.
3 more elements
Dependencies are inferred from the claim text.