Method of silver (AG) electroless plating on ITO electrode
AssigneeLG.Philips LCD Co., Ltd.
InventorsJae-Jeong Kim, Seung-Hwan Cha
Life of this patent
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Abstract
A method of silver (Ag) electroless plating on an indium tin oxide (ITO) electrode comprises preparing a substrate on which the indium tin oxide (ITO) electrode is formed, depositing tin (Sn) on the indium tin oxide (ITO) electrode, depositing silver (Ag) on the indium tin oxide (ITO) electrode by dipping the indium tin oxide (ITO) electrode into an activation solution and plating silver (Ag) on the indium tin oxide (ITO) electrode by dipping the indium tin oxide (ITO) electrode into an electroless plating solution containing magnesium ions and silver ions.
Claims57
A method of silver (Ag) electroless plating on an indium tin oxide (ITO) electrode, comprising:
- preparing a substrate on which the indium tin oxide (ITO) electrode is formed;
- forming a tin (Sn) film on the indium tin oxide (ITO) electrode;
- forming a silver (Ag) film on the indium tin oxide (ITO) electrode by dipping the indium tin oxide (ITO) electrode into an activation solution;
- and
- plating silver (Ag) on the indium tin oxide (ITO) electrode by dipping the indium tin oxide (ITO) electrode into an electroless plating solution containing magnesium ions and silver ions.
A method of silver (Ag) electroless plating on a metal line, comprising:
- preparing a substrate on which the metal electro line is formed;
- forming a silver (Ag) film on the metal line by dipping the metal line into an activation solution;
- and
- plating silver (Ag) on the metal line by dipping the metal line into an electroless plating solution containing magnesium ions and silver ions.
A method of silver (Ag) electroless plating on an indium tin oxide (ITO) electrode for a liquid crystal display (LCD) device, comprising:
- preparing a substrate on which the indium tin oxide (ITO) electrode is formed;
- forming a tin (Sn) film on the indium tin oxide (ITO) electrode;
- forming a silver (Ag) film on the indium tin oxide (ITO) electrode by dipping the indium tin oxide (ITO) electrode into an activation solution;
- and
- plating silver (Ag) on the indium tin oxide (ITO) electrode by dipping the indium tin oxide (ITO) electrode into an electroless plating solution containing magnesium ions and silver ions.
A method of silver (Ag) electroless plating on a metal line for a liquid crystal display (LCD) device, comprising:
- preparing a substrate on which the metal line is formed;
- forming a silver (Ag) film on the metal electro line by dipping the metal line into an activation solution;
- and
- plating silver (Ag) on the metal electro line by dipping the metal line into an electroless plating solution containing magnesium ions and silver ions.
A method of silver (Ag) electroless plating on a metal line for a semiconductor element, comprising:
- preparing a substrate on which the metal line is formed;
- forming a silver (Ag) film on the metal line by dipping the metal line into an activation solution;
- and
- plating silver (Ag) on the metal line by dipping the metal line into an electroless plating solution containing magnesium ions and silver ions.
Dependencies are inferred from the claim text.