Method for detecting defect of semiconductor device
AssigneePowerchip Semiconductor Corp.
InventorsHoung-Jie Chang, Sheng-Ju Chang
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Abstract
A method for detecting defects of a semiconductor device is provided. The semiconductor device comprises at least a substrate, a gate, a source region, a drain region, a plug, an insulating layer, and a conducting line. The plug electrically connects the source region or the drain region and is above a portion of the gate. At least a defect exists between the plug and the gate. The method comprises: polishing the semiconductor device until the plug above the gate is removed; cleaning the semiconductor device; removing the insulating layer between the gate and the plug; and detecting the defect between the plug and the gate.
Claims14
A method of detecting defects of a semiconductor device, said semiconductor device comprising a substrate, a gate, a source region, a drain region, a plug, an insulating layer, and a conducting line, said plug electrically connected with one of said source region and said drain region and located above a portion of said gate, at least a defect existing between said plug and said gate, said method comprising:
- polishing said semiconductor device until said plug above said gate is substantially removed;
- cleaning said semiconductor device;
- removing said insulating layer between said gate and said plug;
- and
- detecting said defect between said plug and said gate.
A method of detecting defects of a semiconductor device, said semiconductor device comprising a conductive line on a substrate, an insulating layer over said conductive line and said substrate, a plug formed in said insulating layer and connected to said substrate, and an interconnection layer over said insulating layer, wherein a portion of said plug is located over said conductive line and a defect exits between said plug and said conductive line said method comprising:
- polishing said semiconductor device until said portion of said plug located over said conductive line is removed;
- removing said insulting layer between said plug and said conductive line;
- and
- detecting said defect.
Dependencies are inferred from the claim text.