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US 6,805,812 B2Granted
Phosphono compound-containing polishing composition and method of using same
AssigneeCabot Microelectronics Corporation
InventorMingming Fang
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Abstract
The invention provides a chemical-mechanical polishing system for a substrate comprising a liquid carrier, a polishing pad and/or an abrasive, a per-type oxidizer, and a phosphono group-containing additive, as well as a method of using the same to polish substrates, particularly nickel-containing substrates.
Claims19
A chemical-mechanical polishing system for a substrate comprising:
- (a) a liquid carrier,
- (b) a polishing pad and/or an abrasive,
- (c) a per-type oxidizer, and
- (d) an additive of the formula
- wherein R1 is a carboxyl group, R2 is a phosphono group or a carboxyl group, and n is an integer from 1 to 50.
2 more elements
Dependencies are inferred from the claim text.