Procedure for encapsulation of electronic devices
AssigneesOSRAM Opto Semiconductors GmbH, Institute of Materials Research and Engineering
InventorsMark Auch, Ewald Guenther, Chua Soo Jin
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Abstract
An encapsulation procedure for an organic light emitting diode (OLED) device, especially for thin and therefore flexible substrates, is disclosed. The device is sealed hermetically against environmental and mechanical damage. The procedure includes the use of a thin cover lid holder and a substrate holder that are designed to handle thin substrates without damaging them. Thin substrates ensure sufficient mechanical flexibility for the OLED devices, and provides an overall thickness of less than 0.5 mm.
Claims18
A method for encapsulating a device comprising:
- mounting a substrate on a substrate holder, the substrate includes a device region and a sealing region surrounding the device region;
- temporarily mounting a cover lid to a lid holder;
- aligning the lid holder with the substrate holder to place the lid on the substrate in preparation for sealing;
- sealing the cover lid to the sealing region on the substrate to encapsulate the device;
- and
- releasing the cover lid from the lid holder.
Dependencies are inferred from the claim text.