Test socket for packaged semiconductor devices

A test socket assembly for use in testing integrated circuits comprising:

• a) a spring holder plate having a plurality of holes for receiving a plurality of electrically conducting springs,
• b) a plurality of helical electrically conductive and compressible springs in the plurality of holes, and
• c) a test socket including a plurality of pins for receiving leads of an integrated circuit, the pins extending into the plurality of holes in the spring holder plate with each pin engaging a spring, wherein the spring holder plate is positionable on a printed circuit board with the plurality of holes being in alignment with electrical contacts on the printed circuit board, the plurality of springs electrically interconnecting the contacts and the plurality of pins, whereby pins of varying length are electrically connected to the pads through the helical springs.