Retention of heat sinks on electronic packages

An electronic package comprising:

• a circuit board;
• a socket affixed to the circuit board;
• a processor fitted in the socket and generating heat;
• a thermal pad engaging the processor and transmitting the heat generated by the processor;
• a heat sink having a pedestal with opposing ends and a plurality of fins separated by spaces and disposed on the pedestal, the heat sink engaging the thermal pad and dissipating the heat generated by the processor and transmitted by the thermal pad;
• and
• an attachment structure removably attaching the heat sink to the thermal pad, the attachment structure including:
• (a) parallel rails disposed adjacent the opposing ends of the pedestal of the heat sink, each rail having a catch, and
• (b) a spring clip having (i) end hooks which engage the catches on the rails to retain the spring clip on the rails and (ii) a strut extending between the hooks, fitting into the space between adjacent fins of the heat sink, and including an apex which contacts substantially centrally the pedestal of the heat sink and applies a force pressing the heat sink toward the thermal pad;
• wherein the opposing ends of the pedestal of the heat sink each have at least one alignment protrusion and the rails each have a surface facing the heat sink with at least one pocket, the protrusions on the heat sink engaging the pockets of the rails to retain the heat sink relative to the rails.

A method of removably attaching a heat sink to a packaged electronic component so that the heat sink dissipates heat generated by the packaged electronic component, the heat sink having a pedestal with opposing ends and a plurality of fins separated by spaces and disposed on the pedestal, the method comprising:

• arranging parallel rails adjacent the opposing ends of the pedestal of the heat sink, each rail having a catch;
• placing an alignment protrusion on a first of the opposing ends of the pedestal of the heat sink into a corresponding pocket in a first of the parallel rails;
• and
• installing a spring clip having (a) end hooks which engage the catches on the rails to retain the spring clip on the rails and (b) a strut extending between the hooks, fitting into the space between adjacent fins of the heat sink, and including an apex which contacts substantially centrally the pedestal of the heat sink and applies a force pressing the heat sink toward the packaged electronic component, whereby the heat sink is removably attached at least indirectly to the packaged electronic component.

A heat sink assembly comprising:

• a heat sink having a pedestal with opposing ends and adjacent fins disposed on the pedestal;
• rails disposed adjacent the opposing ends of the pedestal of the heat sink, each rail having a catch;
• and
• a spring clip having (a) end hooks which engage the catches on the rails and (b) a strut extending between the hooks and fitting between the adjacent fins of the heat sink, and including an apex which contacts substantially centrally the pedestal of the heat sink and applies a force thereto,
• wherein the opposing ends of the pedestal of the heat sink each have at least one alignment protrusion and the rails each have a surface facing the heat sink with at least one pocket, the protrusions on the heat sink engaging the pockets of the rails to retain the heat sink relative to the rails.

A method of removably attaching a heat sink to a packaged electronic component so that the heat sink dissipates heat generated by the packaged electronic component, the method comprising:

• arranging parallel rails adjacent opposing ends of a pedestal of the heat sink, each rail having a catch;
• placing an alignment protrusion on a first end of the pedestal of the heat sink into a corresponding pocket in at least one of the rails:
• engaging end hooks of a spring clip to the catches;
• extending a strut of the spring clip between the hooks and adjacent fins of the heat sink;
• and
• contacting an apex of the strut of the spring clip to a central portion of the pedestal of the heat sink, thereby applying a force pressing the heat sink toward the packaged electronic component, whereby the heat sink is removably attached at least indirectly to the packaged electronic component.