Apparatus for package reduction in stacked chip and board assemblies

An electronic device package, comprising:

• a first substrate having a first surface and a second opposing surface;
• a second substrate having a first surface and a second opposing surface, the first surface of the second substrate adjacent to the first surface of the first substrate;
• at least one semiconductor die attached to the second opposing surface of the first substrate;
• at least another semiconductor die attached to the second opposing surface of the second substrate;
• at least one bond wire extending from the at least one semiconductor die attached to the second opposing surface of the first substrate to the first surface of the first substrate;
• at least another bond wire extending from the at least another semiconductor die attached to the second opposing surface of the second substrate to the first surface of the second substrate;
• at least one conductive element extending between the first surface of the first substrate and the first surface of the second substrate and electrically connecting the first substrate and the second substrate;
• and
• a dielectric material disposed between the first substrate and the second substrate and encapsulating at least a portion of the at least one bond wire, the at least another bond wire, and the at least one conductive element.

An electronic device package, comprising:

• a first substrate having a first surface and a second opposing surface;
• a second substrate having a first surface and a second opposing surface, the first surface of the second substrate adjacent to the first surface of the first substrate;
• at least one semiconductor die attached to the second opposing surface of the first substrate;
• at least another semiconductor die attached to the second opposing surface of the second substrate;
• at least one bond wire extending from the at least one semiconductor die attached to the second opposing surface of the first substrate to the first surface of the first substrate;
• at least another bond wire extending from the at least another semiconductor die attached to the second opposing surface of the second substrate to the first surface of the second substrate;
• at least one conductive element extending between the first surface of the first substrate and the first surface of the second substrate and electrically connecting the first substrate and the second substrate;
• at least one conductive element attached to the second opposing surface of the first substrate configured to connect the electronic device package to a carrier substrate wherein the at least one conductive element attached to the second opposing surface of the first substrate is attached to the carrier substrate;
• and
• a dielectric material disposed between the first substrate and the carrier substrate and encapsulating at least a portion of the at least one conductive element attached to the second opposing surface of the first substrate.