Test patterns for measurement of low-k dielectric cracking thresholds

A test pattern for determining a cracking threshold for a dielectric material on a substrate comprising:

• two or more test structures disposed on the substrate;
• each test structure comprising two metal structures separated by the dielectric material having a width which is different for each test structure;
• and
• wherein the cracking threshold is approximately equal to the largest width of dielectric material that is cracked after processing.

A test pattern comprising:

• two or more test structures disposed on a substrate;
• each test structure includes two or more test substructures;
• and
• each test substructure comprising a sealing ring, two metal structures having a first width which is different for each test substructure, and a dielectric material disposed between each metal structure and the sealing ring and between the two metal structures, the dielectric material between the two metal structures having a second width which is substantially constant for each test substructure and different for each test structure.