US 6,787,739 B2 · Apparatus for processing a substrate including a heating apparatus

Abstract

An apparatus for heating a substrate of a semiconductor device includes a hot plate, on which a semiconductor substrate is placed, and a heater for heating the hot plate. The hot plate is preferably a composite plate including a plurality of plates having different thermal conductivities from each other. For example, a first plate adjacent to the heater can be made of aluminum, which has a relatively high thermal conductivity. A second plate, laminated on top of the first plate, can be made of titanium or stainless steel, which both have a thermal conductivity lower than aluminum. A composite hot plate as disclosed herein is better able to maintain a constant temperature and a uniform temperature distribution in order to more uniformly heat a substrate and to reduce an amount of energy required for the heating process. In addition, the reliability and productivity of the semiconductor device manufactured by the apparatus can be improved.

Claims19

Dependent claims

An apparatus for heating a substrate comprising:

a heater for generating heat to heat the substrate;
and
a hot plate for supporting the substrate, said hot plate arranged above the heater and comprising a plurality of plates including an upper plate for supporting the substrate, wherein each of the plates has a different thermal conductivity from at least one of the other plates, wherein a lower plate has a thermal conductivity higher than the upper plate, and wherein the substrate is heated by transferring heat from the heater to the substrate through the plurality of plates of the hot plate.

Dependencies are inferred from the claim text.

Apparatus for processing a substrate including a heating apparatus

Life of this patent

Apparatus for processing a substrate including a heating apparatus

Life of this patent

Abstract

Claims19