Dielectric element and method for fabricating the same

A method for fabricating a dielectric element, comprising:

• (I) forming a conductive layer, which is to be a lower electrode, on a substrate;
• (II) forming a dielectric layer on the conductive layer;
• (III) forming an Ru layer on the dielectric layer;
• (IV) forming a photoresist layer on the Ru layer;
• (V) selectively exposing the photoresist layer, and forming a photoresist pattern as a mask on the Ru layer;
• (VI) forming a Pt layer, which is to be an upper electrode, on an exposed or unmasked area of the Ru layer by electroplating using a Pt plating solution utilizing the Ru layer as an electroplating electrode;
• and
• (VII) removing the photoresist pattern and the Ru layer provided thereunder.

A method for fabricating a dielectric element, comprising:

• (I) forming an Ru layer on a substrate;
• (II) forming a photoresist layer on the Ru layer;
• (III) selectively exposing the photoresist layer, and forming a photoresist pattern as a mask on the Ru layer;
• (IV) forming a Pt layer, which is to be a lower electrode, on an exposed or unmasked area of the Ru layer by electroplating using a Pt plating solution utilizing the Ru layer as an electroplating electrode;
• (V) removing the photoresist pattern and the Ru layer provided thereunder;
• (VI) forming a dielectric layer on the Pt layer;
• (VII) forming an Ru layer on the dielectric layer;
• (VIII) forming a photoresist layer on the Ru layer;
• (IX) selectively exposing the photoresist layer, and forming a photoresist pattern as a mask on the Ru layer;
• (X) forming a Pt layer, which is to be an upper electrode, on an exposed or unmasked area of the Ru layer by electroplating using a Pt plating solution utilizing the Ru layer as an electroplating electrode;
• and
• (XI) removing the photoresist pattern and the Ru layer provided thereunder.