Microelectronic fabrication die electrical test method providing enhanced microelectronic fabrication die electrical test efficiency

A method for electrically testing a series of semiconductor integrated circuit microelectronic fabrication die fabricated within a semiconductor substrate comprising:

• providing a semiconductor substrate having fabricated therein a series of semiconductor integrated circuit microelectronic fabrication die;
• electrical testing the series of semiconductor integrated circuit microelectronic fabrication die while employing an electrical test apparatus to thus determine from the series of semiconductor integrated circuit microelectronic fabrication die at least one sub-series of electrically unacceptable semiconductor integrated circuit microelectronic fabrication die;
• determining whether the semiconductor substrate may be reworked;
• and
• electrically retesting within the semiconductor substrate only the at least one sub-series of electrically unacceptable semiconductor integrated circuit microelectronic fabrication die, and only if the semiconductor substrate may be reworked.