Method for removing particles from a semiconductor processing tool
AssigneeMotorola, Inc.
InventorsLarry E. Frisa, Scott S. Kellogg, Grant W. McEwan, Michael N. Montgomery, Iraj Eric Shahvandi
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Abstract
A method for removing particles from a semiconductor processing tool is provided. The method comprises providing a pick-up wafer for picking up particles from a semiconductor processing tool, inserting said pick-up wafer into said semiconductor processing tool and placing the pick-up wafer on a receiving member, applying an electrostatic charge to said pick-up wafer, leaving said pick-up wafer in said semiconductor processing tool for a predetermined dwell time; and removing said pick-up wafer from said semiconductor processing tool. Further, a method for processing semiconductor wafers is provided.
Claims21
A method for removing particles from a semiconductor processing tool, comprising the steps of:
- providing a pick-up wafer for picking up particles from a semiconductor processing tool, wherein providing the pick-up wafer comprises providing a patterned wafer containing at least one metal layer and at least one dielectric layer to form at least one parallel plate capacitor within the patterned wafer;
- inserting said pick-up wafer into said semiconductor processing tool and placing the pick-up wafer on a receiving member;
- applying an electrostatic charge to said pick-up wafer;
- leaving said pick-up wafer in said semiconductor processing tool for a predetermined dwell time;
- and
- removing said pick-up wafer from said semiconductor processing tool after the predetermined dwell time.
Dependencies are inferred from the claim text.