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US 6,785,135 B2Granted
Cooling device, electronic apparatus, display unit, and method of producing cooling device
AssigneeSony Corporation
InventorsMotosuke Ohmi, Eisaku Kato, Minehiro Tonosaki
Life of this patent
Estimating the term…
Abstract
A cooling device includes a flow-path substrate, an intermediate substrate, and a lid-substrate each made of a polyimide resin, and a condenser substrate incorporated into holes of the intermediate substrate and an evaporator substrate which are made of a metal having a high thermal conductivity, whereby heat from a heat source can be enclosed into the evaporator substrate and the condenser substrate, so that the quantity of the latent heat can be substantially increased.
Claims16
A cooling device comprising:
- a first substrate having grooves constituting a heat pipe formed therein so as to be exposed to the surface thereof, the grooves including at least a groove positioned in correspondence to a wick and another groove that does not correspond to a wick;
- a second substrate made of a metal or a material having a thermal conductivity substantially equal to that of a metal, the second substrate having at least the groove for the wick formed at the surface thereof, said surface being joined to the first substrate;
- and
- a third substrate into which the second substrate is incorporated so as to be exposed to the surface of the third substrate, said surface of the third substrate being joined to the first substrate;
- at least one of the first substrate and the third substrate being made of a polyimide resin.
2 more elements
A cooling device comprising:
- a first substrate having open grooves constituting a heat pipe formed therein, the open groove including at least an open groove positioned in correspondence to a wick and another groove that does not correspond to a wick;
- a second substrate made of a material having a thermal conductivity substantially equal to that of a metal, the second substrate having at least the groove for the wick formed at the surface thereof, said surface being joined to the first substrate;
- a third substrate into which the second substrate is incorporated so as to be exposed to the surface of the third substrate, said surface of the third substrate being joined to the first substrate;
- and
- a lid-substrate joined to the surface of the first substrate so as to cover said surface which is opposite to the side of the first substrate where the first substrate and the second substrate are joined to each other;
- at least one of the first substrate, the third substrate, and the lid-substrate being made of polyimide resin.
3 more elements
An electronic apparatus comprising:
- a slot to or from which a card type storage device containing a flash memory and a driver can be attached or detached;
- and
- a cooling device arranged adjacently to the slot,
- the cooling device comprising a first substrate having grooves constituting a heat pipe formed therein so as to be exposed to the surface thereof, the groove including at least a groove positioned in correspondence to a wick and another groove that does not correspond to a wick,
- a second substrate made of a metal or a material having a thermal conductivity substantially equal to that of a metal, the second substrate having at least the groove for the wick formed at the surface thereof, said surface being joined to the first substrate, and
- a third substrate into which the second substrate is incorporated so as to be exposed to the surface of the third substrate, said surface of the third substrate being joined to the first substrate,
- the first substrate and the third substrate being made of a polyimide resin.
4 more elements
A display unit comprising:
- a display section;
- a driver for displaying;
- and
- a cooling device,
- the cooling device comprising a first substrate having grooves constitute a heat pipe formed therein to be exposed to the surface thereof, the groove including at least a groove positioned in correspondence to a wick and another groove that does not correspond to a wick,
- a second substrate made of metal or a material having a thermal conductivity substantially equal to that of a metal, the second substrate having at least the groove for the wick formed at the surface thereof, said surface being joined to the first substrate, and
- a third substrate into which the second substrate is incorporated so as to be exposed to the surface of the third substrate, said surface of the third substrate being joined to the first substrate,
- the first substrate and the third substrate being made of polyimide resin.
5 more elements
An electronic apparatus comprising:
- a central processing unit:
- and
- a cooling device arranged adjacently to the central processing unit,
- the cooling device comprising a first substrate having grooves constituting a heat pipe formed therein so as to be exposed to the surface thereof, the groove including at least a groove positioned in correspondence to a wick and another groove that does not correspond to a wick;
- a second substrate made of metal or a material having a thermal conductivity substantially equal to that of a metal, the second substrate having at least the groove for the wick formed at the surface thereof, said surface being joined to the first substrate;
- and
- a third substrate into which the second substrate is incorporated so as to be exposed to the surface of the third substrate, said surface of the third substrate being joined to the first substrate;
- the first substrate and the third substrate being made of polyimide resin.
5 more elements
A method of producing a cooling device comprising the steps of:
- forming a first substrate made of a polyimide resin and having grooves constituting a heat pipe formed therein so as to be exposed to the surface thereof, the grooves including at least a groove positioned in correspondence to a wick and another groove that does not correspond to a wick,
- forming a second substrate made of a metal or a material having a thermal conductivity substantially equal to that of a metal, the second substrate having at least the groove for the wick formed on the surface thereof;
- incorporating the second substrate into a third substrate so as to be exposed to the surface of the third substrate;
- and
- joining the surface of the surface of the first substrate and the one side of the third substrate to each other.
2 more elements
A method of producing a cooling device comprising the steps of:
- forming a first substrate having open grooves constituting a heat pipe formed therein, the grooves including at least a groove positioned in correspondence to a wick and another groove that does not correspond to a wick;
- forming a second substrate made of a metal or a material having a thermal conductivity substantially equal to that of a metal, the second substrate having at least the groove for the wick formed on the surface thereof;
- forming a first surface of the first substrate to a lid-substrate to form a flow-path for a working liquid;
- incorporating the second substrate into a third substrate so as to be exposed to the surface of the third substrate;
- and
- joining the second surface of the first substrate to the surface of the third substrate.
3 more elements
Dependencies are inferred from the claim text.