Compliant off-chip interconnects
AssigneeGeorgia Tech Research Corporation
InventorsQi Zhu, Lunya Ma, Suresh K. Sitaraman
Life of this patent
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Abstract
Electronic packages having compliant off-chip interconnects and methods of fabricating compliant off-chip interconnects are disclosed. A representative electronic package includes a substrate and a free-standing compliant off-chip interconnect. The free-standing compliant off-chip interconnect includes a first free-standing arcuate structure that is substantially parallel to the substrate. In addition, the method of fabricating free-standing arcuate structure compliant off-chip interconnects includes: depositing an arcuate structure compliant off-chip interconnect material; and forming the free-standing arcuate structure compliant off-chip interconnect.
Claims19
An electronic package comprising:
- a substrate;
- and
- a free-standing compliant off-chip interconnect disposed on the substrate, wherein the free-standing compliant off-chip interconnect includes a first free-standing arcuate structure that is substantially parallel to the substrate, wherein the first free-standing arcuate structure is curved in the plane substantially parallel to the substrate.
A free-standing compliant off-chip interconnected structure, comprising:
- a substrate;
- a first arcuate structure disposed on the substrate, wherein the first arcuate structure is curved in the plane substantially parallel to the substrate;
- a second arcuate structure, wherein the first arcuate structure and the second arcuate structure are disposed in substantially parallel planes, wherein the second arcuate structure is curved in the plane substantially parallel to the substrate;
- and
- a middle post, wherein the first arcuate structure is connected to a lower portion of the middle post, and wherein the second arcuate structure is connected to a upper portion of the middle post.
Dependencies are inferred from the claim text.