Encapsulated inorganic resists
AssigneeMassachusetts Institute of Technology
InventorTheodore H. Fedynyshyn
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Abstract
The present invention describes encapsulated inorganic resists which are compatible with conventional resist processing such as spin casting from organic solvents and development with aqueous 2.38% TMAH developers. The resist includes encapsulated inorganic materials as resist components, a fact that significantly increases the plasma etch selectivity of the resists compared to conventional polymeric resists. In effect, these resist systems act as a photoimagable single layer hard mask, although use as the top layer in a bilayer resist scheme is contemplated.
Claims15
A positive photosensitive resist composition comprising a resin binder and an encapsulated inorganic material comprising core particles having an average size less than about 10 nanometer, wherein the photoresist is sufficiently base soluble upon activation by radiation to function as a positive resist.
Dependencies are inferred from the claim text.