Back to results
US 6,783,596 B2Granted
Wafer handling device
AssigneeInfineon Technologies AG
InventorsAndre Schaefer, Andrea Zuckerstaetter
Life of this patent
Estimating the term…
Abstract
The present invention provides a wafer handling device having a base plate (G; G′), which has a first and a second supporting surface for a respective wafer (W1, W2) to be laid on; and a fixing device (K1, K2, S; K1′, K2′, S′) for the detachable fixing of the respective wafer (W1, W2) on the first and second supporting surface; the fixing device (K1, K2, S; K1′, K2′, S′) being configured in such a way that it contacts the respective wafer (W1, W2) only in the outer edge region of the side facing away from the supporting surface.
Claims4
A wafer handling device comprising:
- a base plate comprising a first and second supporting surface for respectively supporting a first and a second wafer laid thereon;
- and
- a fixing device comprising two ring-like flaps for detachably fixing the first and second wafer on the first and second supporting surface, respectively, wherein the fixing device is configured to contact the first and second wafer on an outer edge region of the surface of the wafers facing away from the supporting surface, and wherein the two ring-like flaps are held on the base plate at a common hinge.
Dependencies are inferred from the claim text.