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AssigneeIndustrial Technology Research Institute
InventorsKuei-Jung Chen, Meng-Chun Chen, Chih-Yi Lai
Estimating the term…
A cutting device for breaking fragile materials is constructed to include a lifting mechanism adapted to move the cutter vertically, a rotary table adapted to control the cutting angle of the cutter on the workpiece, a feed mechanism adapted to control the federate of the cutter, and a rotary mechanism adapted to rotate the cutter for enabling the cutter to cut the workpiece with one of multiple cutting points thereof selectively.
A cutting device for breaking fragile materials, comprising:
A cutting device for breaking fragile materials, comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
Apparatus for manufacture or treatment: apparatus for mechanical treatment or grinding or cutting
By breaking, e.g. dicing: with preliminary treatment, e.g. weakening by scoring
Cutting: tool or tool with support
Generic processes or apparatus for the manufacture or treatment of devices covered
Term ended 5 Feb 2023 (estimated)
1. Field of the Invention
The present invention relates to a cutting device for breaking fragile materials such as semiconductor wafers or the like and, more particularly, to such a cutting device, which uses lifting, rotary, and feed mechanisms to adjust the position and angle of the diamond cutter, enabling the diamond cutter to scribe and break the workpiece precisely.
2. Description of Related Art
FIG. 1 illustrates a cutting device installed in a wafer scribing and breaking apparatus according to the present invention.
FIG. 2 is an exploded view of the cutting device according to the present invention.
FIG. 3 is an exploded view of the lifting mechanism for the cutting device according to the present invention.
With reference to FIG. 1, a cutting device 1 is installed in the worktable 91 of a wafer scribing and breaking apparatus 9, and controlled to scribe a semiconductor wafer 92.
With reference to FIG. 2, the aforesaid fragile material cutting mechanism is comprised of a base frame 2, a lifting mechanism 3, a rotary table 4, a cutter holder 5, and a cutter module 6. The base frame 2 is installed in the worktable 91 of the wafer scribing and breaking apparatus 9 (see FIG. 1), having a front mounting face 21 at the front side. The lifting mechanism 3 is comprised of a base block 32 located on the mounting face 21 of the base frame 2, and a lifting block 31 coupled to the base block 32 for vertical movement on the base block 32.
Referring to FIG. 3, the lifting mechanism 3 further comprises a screw rod 35 fastened pivotally with the base block 32, a nut 36 threaded onto the screw rod 35, a connecting block 360 connected between the lifting block 31 and the nut 36, and a power drive 37 adapted to drive the screw rod 35 in the base block 32. When driving the screw rod 35, the lifting block 31 is driven to move with the nut 36 upwards or downwards along the screw rod 35. The screw rod 35 preferably has a relatively greater screw pitch to provide a relatively greater vertical moving distance during lifting/lowering of the lifting mechanism 3.