Integrated heat dissipation apparatus
AssigneeCpumate Inc.
InventorTsai Liang Chiang
Life of this patent
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Abstract
An integrated heat dissipation apparatus, having a first heat dissipating element, a second heat dissipating element, a thermal conductive heat sink and at least one L-shape heat pipe. The thermal conductive heat sink has a connecting surface and a thermal conductive surface opposing the connecting surface. The first heat dissipating element is mounted on the thermal conductive surface. A plurality of thermal conductors with thermal conductivity larger than that of the thermal conductive heat sink are mounted to the connecting surface. The L-shape heat pipe has two ends, including one end serial connecting to the second heat dissipating element, and the other end extending to connect with the thermal conductors on the thermal conductive heat sink.
Claims10
An integrated heat dissipation apparatus, comprising:
- a first heat dissipating element;
- a second heat dissipating element;
- a thermal conductive heat sink, having a connecting surface and a thermal conductive surface opposing to the connecting surface, wherein the first heat dissipating element is mounted on the thermal conductive surface;
- a thermal conductor mounted to the connecting surface, wherein the thermal conductor has a thermal conductive coefficient larger than that of the thermal conductive heat sink;
- and
- at least one heat pipe with two terminal ends, wherein one terminal end is serially connected to the second heat dissipating element, and the other terminal end extends to connect with the thermal conductor.
Dependencies are inferred from the claim text.