Mechanisms for making and inspecting reticles
AssigneeKLA-Tencor Corporation
InventorsLance A. Glasser, Jun Ye, Shauh-Teh Juang, David S. Alles, James N. Wiley
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AssigneeKLA-Tencor Corporation
InventorsLance A. Glasser, Jun Ye, Shauh-Teh Juang, David S. Alles, James N. Wiley
Estimating the term…
A reusable circuit design for use with electronic design automation EDA tools in designing integrated circuits is disclosed, as well as reticle inspection and fabrication methods that are based on such reusable circuit design. The reusable circuit design is stored on a computer readable medium and contains an electronic representation of a layout pattern for at least one layer of the circuit design on an integrated circuit. The layout pattern includes a flagged critical region which corresponds to a critical region on a reticle or integrated circuit that is susceptible to special inspection or fabrication procedures. In one aspect of the reusable circuit design, the special analysis is performed during one from a group consisting of reticle inspection, reticle production, integrated circuit fabrication, and fabricated integrated circuit inspection.
A method of inspecting a sample having a sample pattern, the method comprising:
A method of processing a sample comprising:
A method of inspecting a sample having a special analysis region associated with a critical region and a normal analysis region associated with a normal region, the method comprising:
A method as recited in 9, wherein the special analysis is performed at a more stringent threshold than the normal analysis.
A method as recited in 11, wherein the normal analysis compares edge positions of corresponding features in the test image and the baseline representation using a first threshold and the special analysis compares edge positions of corresponding features in the test image and the baseline representation using a second threshold.
A method as recited in 9, wherein the special analysis compares line widths of corresponding features in the test image and the baseline representation.
A method as recited in 13, wherein the corresponding features are gate electrodes.
A method as recited in 9, wherein the special analysis compares areas of corresponding features in the test image and the baseline representation.
A method as recited in 15, wherein the corresponding features are vias or contact holes.
A method as recited in 9, the comparison comprising
A method of inspecting a sample having a sample pattern, the method comprising:
Dependencies are inferred from the claim text.