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US 6,747,866 B1Granted
Electronic module restraint apparatus
AssigneeRockwell Collins, Inc.
InventorsSteve I. Lebo, Scott J. Sellner
Life of this patent
Estimating the term…
Abstract
A ruggedized electronics module is disclosed. The ruggedized electronics module includes a housing supporting an electronic subsystem device. The housing is environmentally sealed. The ruggedized electronics module also includes a module restraint extending from the housing the restraint is configured to mate with a complementary shaped restraint on a mounting adapter. The module restraint is configured to restrain the module from movement in six degrees of freedom.
Claims20
A ruggedized electronics module, comprising:
- a housing supporting an electronic sub-system device, the housing being environmentally sealed;
- a module restraint extending from the housing, the restraint configured to mate with a complementary shaped restraint on a mounting adapter, the module restraint, configured to restrain the module from movement in six degrees of freedom.
A modular electronics system, comprising:
- a mounting adapter having a mounting restraint;
- an electronic module having a module restraint, the module restraint configured to mate with the mounting restraint;
- and
- a fastener configured to couple the module restraint to the mounting restraint,
- wherein the fastener, module restraint, and mounting restraint prevent motion in six degrees of freedom to overcome manufacturing tolerances.
2 more elements
A module restraint, comprising:
- an electronic module housing extension, extending from a housing, the electronic module housing extension including;
- a first surface;
- a second surface, the first surface and the second surface meeting along an axis at an angle, the axis at an angle less than ninety degrees with respect to a bottom surface of the electronic module housing.
Dependencies are inferred from the claim text.