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US 6,747,865 B2Granted
Heat sink for electronic components
AssigneeAavid Thermalloy, LLC
InventorsCesare Capriz, Ashok Patel
Life of this patent
Estimating the term…
Abstract
A heat sink for electronic components having a heat dissipator connected to at least one electronic component and a ventilator designed to supply the heat dissipator with air. The heat dissipator includes at least one thermally conductive plate connected to the electronic component and having a plurality of openings.
Claims18
A heat sink for an electronic component comprising:
- heat dissipating means connected to the electronic component, the dissipating means having a plurality of thermally conductive plates positioned parallel to each other in succession and having a plurality of openings passing through its dissipating surface and constituting corresponding air passage zones;
- a base to which the plurality of plates is connected, said base having a free surface attachable to the electronic component, said heat dissipating means being attachable to the electronic component;
- and
- ventilation means for supplying the heat dissipating means with air.
1 more element
Dependencies are inferred from the claim text.