Termination ring for integrated circuit
AssigneeLSI Logic Corporation
InventorsMaad Al-Dabagh, Thomas Antisseril, Bo Shen, Prasad Subbarao, Radoslav Ratchkov
Life of this patent
Estimating the term…
Abstract
A rectangular termination ring for a power distribution mesh is placed on the upper two layers of an integrated circuit and may be placed over some I/O circuitry. The strapping connecting the bonding pads to the termination ring are placed on upper levels of the integrated circuit, minimizing the via requirements and freeing space for additional circuitry. Further, the termination ring may be adapted to work in conjunction with L-shaped, as well as other power distribution meshes.
Claims26
A power distribution system for an integrated circuit die comprising:
- a first electrically conductive ring about the periphery of said die wherein said first ring is located above at least one I/O circuit;
- a second electrically conductive ring substantially inwardly offset from said first ring and positioned on the layer below the layer of said first ring;
- a first connection from said first ring to a first bonding pad wherein at least a continuous electrical connection is located in the same layer as said first ring;
- and
- a second connection from said second ring to a second bonding pad wherein at least a continuous electrical connection is located in the same layer as said second ring.
An integrated circuit with a power distribution system comprising:
- a first electrically conductive ring about the periphery of the die of said integrated circuit wherein said first ring is located above at least one I/O circuit;
- a second electrically conductive ring substantially inwardly offset from said first ring and positioned on the layer below the layer of said first ring;
- a first connection from said first ring to a first bonding pad wherein at least a continuous electrical connection is located in the same layer as said first ring;
- and
- a second connection from said second ring to a second bonding pad wherein at least a continuous electrical connection is located in the same layer as said second ring.
An integrated circuit with a power distribution system comprising:
- a first electrically conductive power distribution means about the periphery of the die of said integrated circuit wherein said first electrically conductive power distribution means is located above at least one I/O circuit;
- a second electrically conductive power distribution means substantially inwardly offset from said first electrically conductive power distribution means and positioned on the layer below the layer of said first electrically conductive power distribution means;
- a first connection means from said first electrically conductive power distribution means to a first off-die connection means wherein at least a continuous electrical connection is maintained in the same layer as said first electrically conductive power distribution means;
- and
- a second connection means from said second electrically conductive power distribution means to a second off-die connection means wherein at least a continuous electrical connection is maintained in the same layer as said second electrically conductive power distribution means.
Dependencies are inferred from the claim text.