US 6,747,340 B2Granted

Multi-level shielded multi-conductor interconnect bus for MEMS

AssigneeMEMX, Inc.

InventorsStephen Matthew Barnes, Samuel Lee Miller, Murray Steven Rodgers

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Abstract

A multi-level shielded multi-conductor interconnect bus for use in interconnecting MEM devices with control signal sources and a method of fabricating a multi-level shielded multi-conductor interconnect bus are disclosed. In one embodiment, a multi-level shielded interconnect bus (410A) formed on a substrate (20) includes first and second level electrically conductive lines (42, 92) arranged in sets of one, two or more conductive lines between first and second level electrically conductive shield walls (46, 66, 96). The first and second level electrically conductive lines (42, 92) are surrounded by various layers of dielectric material (30, 50, 80, 100). A first level electrically conductive shield (78) overlies the first level electrically conductive lines (42) and shield walls (46, 66). A second level electrically conductive shield (112) overlies the second level electrically conductive lines (92) and shield walls (96).

Claims28

Dependent claims

A multi-level shielded multi-conductor interconnect bus comprising:

a substrate;
a first dielectric layer overlying and supported by at least a portion of said substrate;
a plurality of parallel first level electrically conductive lines formed on said first dielectric layer;
a first level electrically conductive shield formed in a spaced relation above said first level electrically conductive lines;
a plurality of first level electrically conductive walls formed on said first dielectric layer, said first level electrically conductive walls extending parallel with said first level electrically conductive lines, each said first level electrically conductive wall including an upper section in contact along at least a portion thereof with a lower side of said first level electrically conductive shield;
a plurality of parallel second level electrically conductive lines formed in a spaced relation above said first level electrically conductive shield;
a second level electrically conductive shield formed in a spaced relation above said second level electrically conductive lines;
and
a plurality of second level electrically conductive walls formed above said first level electrically conductive shield, said second level electrically conductive walls extending parallel with said second level electrically conductive lines, each said second level electrically conductive wall including a lower section in contact along at least a portion thereof with an upper side of said first level electrically conductive shield and an upper section in contact along at least a portion thereof with a lower side of said second level electrically conductive shield;
said first level electrically conductive lines and said first level electrically conductive walls being arranged in pattern wherein at least one of said first level electrically conductive walls is located between sets of said first level electrically conductive lines, each said set of first level electrically conductive lines including at least one of said first level electrically conductive lines;
said second level electrically conductive lines and said second level electrically conductive walls being arranged in pattern wherein at least one of said second level electrically conductive walls is located between sets of said second level electrically conductive lines, each said set of second level electrically conductive lines including at least one of said second level electrically conductive lines.

8 more elements

A multi-level shielded multi-conductor interconnect bus comprising:

a substrate;
a first dielectric layer overlying and supported by at least a portion of said substrate;
a plurality of parallel first level electrically conductive lines formed on said first dielectric layer;
a first level electrically conductive shield formed in a spaced relation above said first level electrically conductive lines;
a plurality of first level electrically conductive walls formed on said first dielectric layer, said first level electrically conductive walls extending parallel with said first level electrically conductive lines, each said first level electrically conductive wall including an upper section in contact along at least a portion thereof with a lower side of said first level electrically conductive shield;
a plurality of parallel second level electrically conductive lines formed in a spaced relation above said first level electrically conductive shield;
a second level electrically conductive shield formed in a spaced relation above said second level electrically conductive lines;
a plurality of second level electrically conductive walls formed above said first level electrically conductive shield, said second level electrically conductive walls extending parallel with said second level electrically conductive lines, each said second level electrically conductive wall including a lower section in contact along at least a portion thereof with an upper side of said first level electrically conductive shield and an upper section in contact along at least a portion thereof with a lower side of said second level electrically conductive shield;
and
a plurality of anchor posts supporting said second level electrically conductive lines in the spaced relation above said first level electrically conductive shield;
said first level electrically conductive lines and said first level electrically conductive walls being arranged in pattern wherein at least one of said first level electrically conductive walls is located between sets of said first level electrically conductive lines, each said set of first level electrically conductive lines including at least one of said first level electrically conductive lines;
said second level electrically conductive lines and said second level electrically conductive walls being arranged in pattern wherein at least one of said second level electrically conductive walls is located between sets of said second level electrically conductive lines, each said set of second level electrically conductive lines including at least one of said second level electrically conductive lines.

9 more elements

A multi-level shielded multi-conductor interconnect bus comprising:

a substrate;
a plurality of first electrically conductive enclosures having a length dimension;
a plurality of first electrically conductive lines disposed at a first level relative to said substrate, wherein at least one of said plurality of first electrically conductive lines extends along said length dimension of each of said plurality of first enclosures and is disposed in spaced relation to at least part of its corresponding said first enclosure;
a plurality of second electrically conductive enclosures having a length dimension;
a plurality of second electrically conductive lines disposed at a second level relative to said substrate that is disposed further from said substrate than said first level, wherein at least one of said plurality of second electrically conductive lines extends along said length dimension of each of said plurality of second enclosures and is disposed in spaced relation to at least part of its corresponding said second enclosure.

2 more elements

Dependencies are inferred from the claim text.