Method of reworking tungsten particle contaminated semiconductor wafers

A method for reworking a tungsten particulate contaminated semiconductor wafer process surface following a tungsten dry etchback process comprising the steps of:

• providing a semiconductor process wafer comprising
• including a dielectric insulating layer having anisotropically etched openings lined with a first barrier/adhesion layer formed according to a first blanket deposition process and an overlying tungsten layer formed according to a second blanket deposition process filling the anisotropically etched openings;
• dry etching in an etchback process to remove the tungsten layer to form a process surface revealing at least a portion of the first barrier/adhesion layer and including tungsten layer particulate contaminants remaining on the process surface;
• performing a chemical mechanical polishing (CMP) process on the process surface to remove a remaining portion of the tungsten layer particulate contaminants and the first barrier/adhesion layer;
• and,
• blanket depositing a second barrier/adhesion layer over the dielectric insulating layer according to a third blanket deposition process.