Capacitor manufacturing method having dielectric formed before electrode

A capacitor manufacturing method, comprising the steps of:

• (a) providing an object to be connected;
• (b) forming an insulating film on said object to be connected;
• (c) forming a first hole in said insulating film;
• (d) forming a first dielectric film on a surface of said first hole, without filling said first hole;
• (e) forming a part of a lower electrode on said first dielectric film, without filling said first hole;
• (f) etching a structure obtained by said step (e) from above a surface of said part of said lower electrode that is formed on the bottom of said first hole, so as to form a second hole reaching said object to be connected in said structure obtained by said step (e);
• (g) forming a remaining part of said lower electrode to fill said first and second holes;
• (h) removing said insulating film after said step (g);
• and
• (i) after said step (h), forming an upper electrode on said first dielectric film.