Micro-etching composition for copper or copper alloy, micro-etching method, and method for manufacturing printed circuit board
AssigneeMec Company Ltd.
InventorsYoshihiro Kurii, Etsuji Kameda, Sachiko Nakamura
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Abstract
A micro-etching composition and a printed circuit board fabricated by using the micro-etching composition are provided. The micro-etching composition, comprising a main ingredient consisting of sulfuric acid and hydrogen peroxide and an assisting ingredient consisting of phenyltetrazole and a chloride ion source, can continuously treat the surface of copper and copper alloys to produce fine microscopic pits for improved adhesion to resins without producing a brown or black deposit. The printed circuit board exhibits excellent adhesion between inner layer circuit patterns and insulation resin layers, and is free from haloing.
Claims10
An aqueous solution for micro-etching copper or a copper alloy comprising a main ingredient consisting of sulfuric acid and hydrogen peroxide, an assisting ingredient consisting of phenyltetrazole and a chloride ion source, and a benzene sulfonic acid.
Dependencies are inferred from the claim text.