Wafer support plate assembly having recessed upper pad and vacuum processing apparatus comprising the same
AssigneeSamsung Electronics Co., Ltd.
InventorGye-Tak Ahn
Life of this patent
Estimating the term…
Abstract
A plate assembly on which a wafer is supported in the processing chamber of a processing apparatus facilitates a precise transfer of the wafer therefrom even when a vacuum atmosphere is present in the chamber. The plate assembly includes an underlying support plate and a pad dedicated to support the rear surface of the wafer. A plurality of recesses, in the form of parallel grooves, extend in the upper surface of the pad so that the rear surface of the wafer can also be exposed to the vacuum atmosphere in the processing chamber. Accordingly, a pressure difference at both sides of the wafer is minimized. Thus, the wafer can be raised off of the plate assembly while the precise position thereof is maintained.
Claims13
A plate assembly for use in supporting a workpiece in a processing chamber while the workpiece is being processes in a vacuum, said plate assembly comprising:
- an underlying plate, and a pad that is disposed on said plate for use in supporting the workpiece, said pad being of a rubbery material and having an upper surface remote from said plate, and said pad having a plurality of parallel grooves extending in the upper surface thereof, said grooves extending depthwise less than completely through the pad and extending lengthwise all the way across said pad from one side of said upper surface of the pad to the other, whereby the vacuum in the processing chamber can act through said grooves on the rear surface of a workpiece that is resting on the upper surface of the pad.
A processing apparatus including:
- a processing chamber;
- a vacuum system connected to said processing chamber so as to evacuate said chamber and thereby produce a vacuum atmosphere in said processing chamber;
- a plate assembly disposed in said processing chamber for supporting a workpiece as the workpiece is being processed, said plate assembly including a plate, and a pad that is disposed on said plate, said pad being of a rubbery material and having an upper surface remote from said plate, and said pad having a plurality of parallel grooves extending in the upper surface thereof, said grooves extending depthwise less than completely through the pad and extending lengthwise all the way across said pad from one side of said upper surface of the pad to the other, whereby the vacuum in the processing chamber can act through grooves on the rear surface of a workpiece that is resting on the upper surface of the pad;
- a lifter disposed in said processing chamber below said plate assembly, said lifter being movable vertically in said processing chamber;
- and
- at least one lift pin extending vertically from said lifter and movable into and out of contact with the rear surface of a workpiece resting on said pad to selectively raise and lower the workpiece from and on to said pad.
Dependencies are inferred from the claim text.