Heat exchanger for electronic/electrical components
AssigneeModine Manufacturing Company
InventorViktor Brost
Life of this patent
Estimating the term…
Abstract
Both dynamic and static cooling capability for cooling electronic or electrical components on a circuit board is achieved in a heat exchanger that includes a circuit board on which the components to be cooled are mounted together with a coolant channel with a coolant inlet and a coolant outlet in heat exchange contact with the circuit board. The heat exchanger includes a container defining a coolant depot adjacent to and in heat exchange relation with the flow channel and adapted to contain a coolant to accept heat rejected by the components when coolant is not flowing in the coolant channel between the inlet and the outlet.
Claims16
A heat exchanger for cooling electronic or electrical components, comprising:
- a first cup-like component having a bottom and a peripheral wall about the bottom;
- a second cup-like component having a bottom and a peripheral wall about the bottom, said second component being nested within said first component with their bottoms and peripheral walls spaced from one another to define a flow channel therebetween;
- a circuit board mounting components to be cooled mounted on said first component bottom in heat conducting relation thereto and on a side thereof opposite said second component bottom;
- an inlet to said flow channel;
- an outlet from said flow channel;
- and
- a cover extending about said second component and sealed to said second component peripheral wall in spaced relation to said second component bottom to define a fluid receiving space, said fluid receiving space being in fluid communication with said flow channel;
- whereby said components to be cooled may be cooled either by fluid circulating in said flow channel by pumping or by fluid in said fluid receiving space.
In a heat exchanger for cooling electronic or electrical components including a circuit board on which the components are mounted and a coolant channel with a coolant inlet and a coolant outlet in heat exchange contact with the circuit board, the improvement including a container defining a coolant depot adjacent to and in heat exchange relation with said flow channel and adapted to contain a coolant to accept heat rejected by said components when coolant is not flowing in said coolant channel between said inlet and said outlet.
Dependencies are inferred from the claim text.