US 6,744,267 B2 · Test system and methodology

Abstract

A test system for testing an electronic device is deployable in two basic configurations. In one of the configurations, a load board (62) that receives a unit (60) of the device is directly attached to a test head (16). In the other configuration, the same load board or one having largely the same pattern of test-head signal transmission positions is coupled through an interface apparatus (66) to a test head. A probe system (64) contacts that load board or/and the interface apparatus. The interface apparatus is normally configured to largely prevent test-head vibrations from being transferred to the probe system. Additionally or alternatively, the load board is vacuum attached to the interface apparatus.

Claims48

Dependent claims

A test system for testing units of an electronic device, the test system comprising:

at least one test head;
at least one load board for receiving a unit of the electronic device, each load board having a pattern of test-head signal transmission positions largely identical to the pattern of test-head signal transmission positions of each other, if any other, load board;
a probe system having a probe;
and
an interface apparatus, the test system being deployable (a) in a direct configuration in which one such load board is directly attached to one such test head for transmitting test signals through that load board's test-head signal transmission positions and (b) in an interface configuration in which one such load board is coupled through the interface apparatus to one such test head for transmitting test signals through that load board's test-head signal transmission positions, in which the probe system contacts the interface apparatus or/and load board, and in which the interface apparatus is configured to largely prevent vibrations in that test head from being transferred through the interface apparatus to the probe system.

2 more elements

A method of testing units of an electronic device with a test system comprising (a) at least one test head, (b) at least one load board for receiving a unit of the electronic device, each load board having a pattern of test-head signal transmission positions largely identical to the pattern of test-head signal transmission positions of each other, if any other, load board, (c) a probe system having a probe, and (d) an interface apparatus, the method comprising:

performing at least one test operation with the test system deployed in a direct configuration in which one such load board that receives a unit of the electronic device is directly attached to one such test head for transmitting test signals through that load board's test-head signal transmission positions;
and
performing at least one test operation with the test system deployed in an interface configuration in which one such load board that receives a unit of the electronic device is coupled through the interface apparatus to one such test head for transmitting test signals through that load board's test-head signal transmission positions, in which the probe system contacts the interface apparatus or/and that load board, and in which the interface apparatus is configured to largely prevent vibrations in that test head from being transferred through the interface apparatus to the probe system.

Dependencies are inferred from the claim text.

Test system and methodology

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Test system and methodology

Life of this patent

Abstract

Claims48