Rotary substrate processing apparatus and method
AssigneeTokyo Electron Limited
InventorsKoji Egashira, Sadayuki Fujishima, Yuji Kamikawa
Life of this patent
Estimating the term…
Loading patent…
AssigneeTokyo Electron Limited
InventorsKoji Egashira, Sadayuki Fujishima, Yuji Kamikawa
Estimating the term…
A rotary substrate processing apparatus includes a rotor 1 having a holding member for holding a plurality of semiconductor wafers W arranged at appropriate intervals and a motor 4 for rotating the rotor 1. The holding member includes open/close holding rods 3 that are moved to open or close the rotor 1 in inserting the wafers W into the rotor 1 sideways and a plurality of constant-position holding rods 2a to 2d for holding the wafers W in cooperation with the open/close holding rods 3. Among the constant-position holding rods 2a to 2d, at least one constant-position holding rod 2a is equipped with a plurality of press members 5 which move toward respective peripheral portions of the wafers W by centrifugal force due to the rotation of the rotor 1. Consequently, it becomes possible to make the wafers W follow the rotation of the rotor 1 ensurely and also possible to reduce slip between the open/close holding rods 3, the constant-position holding rods 2a to 2d and the wafers W. Therefore, it is possible to accomplish both improvement in processing efficiency for the substrates and reduction in abrasion amount of the holding member and also possible to increase a life span of the apparatus.
A rotary substrate processing apparatus comprising:
A rotary substrate processing apparatus comprising:
A rotary substrate processing apparatus comprising:
Dependencies are inferred from the claim text.