Ball grid array connector
AssigneeTyco Electronics EC K.K.
InventorsHiroshi Shirai, Akira Kubo
Life of this patent
Estimating the term…
Abstract
A ball grid array connector having an insulative housing with a plurality of contacts in electrical connection with corresponding solder balls that protrude from a surface of the housing. The solder balls form a soldering region for attachment to a circuit board. The housing has a center of gravity biased from a center of the soldering region, and a positional compensation member is attached to the housing and the circuit board. The positional compensation member prevents the housing from becoming inclined with respect to the circuit board when the solder balls are attached to the circuit board and prevents the housing from becoming inclined with respect to an electronic part when the electronic part is mounted to the housing on a side opposite from the circuit board.
Claims22
An electrical connector comprising:
- an insulative housing having a plurality of contacts in electrical connection with corresponding solder balls that protrude from a surface of the housing to form a soldering region for attachment to a circuit board, the housing having a center of gravity biased from a center of the soldering region;
- and
- a positional compensation member attached to the housing and the circuit board to prevent the housing from becoming inclined with respect to the circuit board when the solder balls are attached to the circuit board.
A ball grid array connector comprising:
- an insulative housing having a plurality of contacts in electrical connection with corresponding solder balls that protrude from a surface of the housing to form a soldering region for attachment to a circuit board;
- a drive mechanism mounted on a side of the housing for sliding a cover mounted on the housing;
- and
- a positional compensation member attached to the housing and the circuit board to prevent the housing from becoming inclined with respect to the circuit board when the solder balls are attached to the circuit board.
Dependencies are inferred from the claim text.