Apparatus for drying semiconductor wafer using vapor dry method

A semiconductor wafer drying apparatus comprising:

• a receptacle containing a cleansing liquid in an amount which will permit semiconductor wafers to a soaking treatment in the cleansing liquid;
• a chamber above said receptacle defining a compartment for introducing a vapor stream for drying said semiconductor wafers after said soaking treatment is completed;
• a vapor supply for discharging vapor into the chamber for cleansing said semiconductor wafers;
• a device for supporting the semiconductor wafer in the receptacle;
• and
• pitch guides located within said apparatus, adjacent to the semiconductor wafer, movable to a first position and a second position in a vertical direction, wherein the pitch guides are separated from the semiconductor wafer at the first position and contact the semiconductor wafer at the second position thus preventing the movement of the semiconductor wafer.

A method for drying semiconductor wafers comprising:

• providing a receptacle containing a cleansing liquid in an amount which will permit semiconductor wafers to a soaking treatment in the cleansing liquid;
• providing a chamber above said receptacle defining a compartment for introducing a vapor stream for drying said semiconductor wafers after said soaking treatment is completed;
• treating said semiconductor wafers by soaking same in the cleansing liquid;
• supplying a cleansing vapor into the chamber;
• supporting the semiconductor wafer in the receptacle;
• and
• providing pitch guides located within said apparatus, adjacent to the semiconductor wafer, movable to a first position and a second position in a vertical direction, wherein the pitch guides are separated from the semiconductor wafer at the first position and contact the semiconductor wafer at the second position;
• and preventing the movement of the semiconductor wafer employing said pitch guides.