Apparatus and method for rinsing substrates

A spin rinse dry chamber, comprising:

• a processing enclosure;
• a rotatable substrate support member disposed in the processing enclosure and having a stem portion in mechanical communication with a motor configured to selectively impart rotational motion thereto, and a disk shaped member axially affixed to a distal end of the stem portion, an upper side of the disk shaped member having an upper substrate receiving surface formed thereon, wherein the upper substrate receiving surface comprises a substantially planar surface having at least one vacuum channel formed therein, the at least one vacuum channel being in fluid communication with a vacuum source, and an annular gas channel positioned proximate an outer perimeter of the substantially planar surface, the annular gas channel being in fluid communication with a gas source;
• and
• a rotatable shield member positioned above the upper substrate receiving surface, the rotatable shield member having a substantially planar lower surface that may be positioned proximate the upper substrate receiving surface in a substantially parallel orientation relative thereto.

A spin rinse dry chamber, comprising:

• a processing enclosure;
• a rotatable substrate support member disposed in the processing enclosure and having a stem portion in mechanical communication with a motor configured to selectively impart rotational motion thereto, and a disk shaped member axially affixed to a distal end of the stem portion, an upper side of the disk shaped member having an upper substrate receiving surface formed thereon, wherein the upper substrate receiving surface comprises a substantially planar surface having at least one vacuum channel formed therein, the at least one vacuum channel being in fluid communication with a vacuum source, and an annular drain channel positioned proximate an outer perimeter of the substantially planar surface;
• and
• a rotatable shield member positioned above the upper substrate receiving surface, the rotatable shield member having a substantially planar lower surface that may be positioned proximate the upper substrate receiving surface in a substantially parallel orientation relative thereto.

A semiconductor processing apparatus, comprising:

• a substrate support member having an upper substrate receiving surface formed thereon;
• a rotatable disk shaped shield member positioned above the substrate receiving surface, the rotatable disk shaped shield member having a substantially planar lower surface positioned in parallel orientation with the upper substrate receiving surface;
• and
• a processing volume having a lower boundary defined by the upper substrate receiving surface, an upper boundary defined by the substantially planar lower surface, and a perimeter boundary defined by an annular gap positioned proximate a perimeter to at least one of the substrate receiving surface and the planar lower surface.

A method for processing a substrate, comprising:

• positioning the substrate on a substrate support member;
• positioning a rotatable shield member having a substantially planar lower surface in a processing position above the substrate such that the substantially planar lower surface is in parallel orientation with an upper surface of the substrate;
• flowing a fulid solution into a processing region defined by the upper surface of the substrate and the substantiallyplanar lower surface via a fluid aperture in the substantially planar lower surface, wherein the fluid solution is confined in the processing region;
• and
• rotating the rotatable shield member while processing the substrate with the fluid.