Apparatus for processing a desired value among an entire range of pressure values to be applied to a wafer in chemical mechanical polishing, the processing providing improved accuracy in representing the desired value, the apparatus comprising:
- a processor programmed to computationally divide the pressure range by the value of a component resolution to define scale portions of the pressure range;
- the processor being programmed to generate a first output signal to identify one of the computationally defined scale portions that includes the desired value;
- and
- the processor being programmed to computationally generate a second output signal to identify a set point that defines the requested value in the identified scale portion.