Blindmate heat sink assembly
AssigneeHewlett-Packard Development Company, L.P.
InventorsJohn P. Franz, Wade David Vinson
Life of this patent
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AssigneeHewlett-Packard Development Company, L.P.
InventorsJohn P. Franz, Wade David Vinson
Estimating the term…
A heat sink and processor assembly that can be easily installed and uninstalled from a circuit board without tools. One preferred embodiment of the heat sink assembly comprises a heat sink component, an alignment cage attached to the base of the heat sink and having an attachment point for releasably attaching a processor. The heat sink assembly further comprises a plurality of alignment pins and alignment tabs that are affixed to the base of the heat sink and interface with a specially designed socket and circuit board so as to align the mating components. The processor chip is installed onto the heat sink and then the combined assembly is installed onto a circuit board mounted socket. The alignment mechanisms provide a method for installing a processor without using tools or having to manually align the processor pins to the socket receptacles.
A socket for receiving an electronic device having connector pins and alignment tabs, said socket comprising:
An assembly comprising:
A method for installing a chip and heat sink assembly to a socket mounted on a circuit board, the method comprising:
A computer system comprising:
Dependencies are inferred from the claim text.