Radiator mechanism and electronic apparatus having same
AssigneeFujitsu Limited
InventorKoichi Inoue
Life of this patent
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Abstract
It is an exemplified object of the present invention to provide a radiator mechanism and electronic apparatus having the radiator mechanism that can prevent destruction, deterioration, and malfunction due to heat of exoergic components or other electronic components, thermal deformation of a housing thereof, and low-temperature burn, without preventing the electronic apparatus including a printed board from miniaturization. The radiator mechanism is comprised of a cooling fan and a through hole provided in a motherboard, thereby thermally protecting a variety of circuit components mounted on the motherboard to provide a stable operation.
Claims6
A radiator mechanism comprising:
- a board, including a front surface and a back surface, on which an exoergic part is to be mounted, said board including a through hole;
- and
- a heat pipe including a first portion disposed on the front surface and a second portion disposed on the back surface and connected to the first portion using the through hole,
- wherein the first portion is connected to the exoergic part;
- and
- wherein the first portion of the heat ripe runs parallel to the front surface and the second portion of the heat give runs parallel to the back surface.
Dependencies are inferred from the claim text.