Wire bond-less electronic component for use with an external circuit and method of manufacture

A wire bond-less electronic component for use with a circuit external to the wire bond-less electronic component, the wire bond-less electronic component comprising:

• a metal flange;
• a semiconductor substrate supported by the flange;
• a semiconductor device supported by the semiconductor substrate;
• and
• a lid located over the semiconductor device, the semiconductor substrate, and the flange, the lid comprising:
• a multi-functional interconnect system electrically coupled to the semiconductor device and electrically coupling together the semiconductor device and the circuit for providing a direct current to the semiconductor device and for providing impedance transformation of electrical signals from the semiconductor device to the circuit and from the circuit to the semiconductor device.