High-reliability interposer for low cost and high reliability applications
AssigneeHigh Connection Density, Inc.
InventorsZhineng Fan, Ai D. Le, Che-Yu Li
Life of this patent
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Abstract
An interposer provides a high reliability interface between an LGA connector and a motherboard. The interposer includes a stepped spacer for each solder interconnection which prevents the relaxation of mechanical contact force while ensuring the integrity of each solder interconnection. The interposer provides noble metal plated contact pads on a first surface to receive the contact members of an LGA connector, and contact pads for BGA solder connections for attachment to a motherboard. A description of the processes to manufacture the interposer is also disclosed.
Claims15
A low cost, high reliability interposer for use in electronic packages, comprising:
- a) at least one dielectric layer having one major surface and at least one edge;
- b) a plurality of conductive pads, each having a first and second surface, spaced apart on said major surface of said at least one dielectric layer, said first surface of said conductive pads being plated with at least one layer of metal, and at least a portion of said second surface of said conductive pads being readily adaptable for connection to a conductive member;
- c) a plurality of openings disposed in the interposer, said openings having a stepped cross section, each opening corresponding to and aligned with one of said conductive pads;
- and
- d) a plurality of reformable conductive members, each one located within one of said openings of said interposer and in electrical contact with said portion of said second surface of said conductive pads.
Dependencies are inferred from the claim text.